The trend of progressively migrating both ESD and EMC immunity from the system/board to the component level is creating unprecedented challenges for the component ESD designer. Implications of EMC-ESD immunity co-design will be reviewed along with several case studies.
The narrow ESD design window in current FinFET technologies creates a special challenge for the robust ESD design of high-speed interfaces. Smart circuit-ESD co-design can help achieve the required ESD robustness without deteriorating functional performance.
This article describes a practical way to improve signal integrity of typical interfaces on the PCB when using external ESD devices.
In this article, we describe how wireless measurements of human body voltage can be made, and why they are important for ESD managers.
This updated version of an article originally published in the March 2014 issue provides details on recent and current developments in the ESD testing of electronic products.
Automotive High-Speed Interfaces: Future Challenges for System-Level HV ESD Protection and First-Time-Right Design
This paper describes future design challenges of discrete system-level ESD protection (high-voltage, low-capacitance) of automotive high-speed data links such as multi-gigabit ETHERNET and SERDES/video-links. A special focus is put on an in-depth analysis and accurate modeling of the complex ESD behavior of the Common Mode Choke (CMC).
This is the second of a two-part series on transmission line pulse (TLP) testing.
If you really want to know whether your footwear and flooring are working together, measure the resistance from the wearer via footwear and flooring to earth (ground).
Heat flow analysis for semiconductor ESD situations can be approximated to one dimension, and then captured with a generalized Ohm’s Law using a complex impedance. Methods can include time-dependent electrothermal pulses and feedback due to self-heating, with solutions readily carried out on any desktop computer.
A fully functional ESD floor prevents static generation and provides an effective path to ground for personnel and equipment. Many conductive and dissipative floors meet STM 7.1 resistance parameters in ANSI/ESD S20.20 but fail to provide adequate electrical contact for grounding equipment with conductive casters and drag chains.