Heat flow analysis for semiconductor ESD situations can be approximated to one dimension, and then captured with a generalized Ohm’s Law using a complex impedance. Methods can include time-dependent electrothermal pulses and feedback due to self-heating, with solutions readily carried out on any desktop computer.
A fully functional ESD floor prevents static generation and provides an effective path to ground for personnel and equipment. Many conductive and dissipative floors meet STM 7.1 resistance parameters in ANSI/ESD S20.20 but fail to provide adequate electrical contact for grounding equipment with conductive casters and drag chains.
TCAD simulation can identify ESD relevant effects and the internal operation of a device under ESD stress conditions that are not generally accessible through conventional measurement techniques. TCAD simulation can help to reduce IC and device design cycle times, resulting in the more timely introduction of innovative products to market.
Controlled environment testing of static control flooring in combination with multiple forms of ESD footwear during the qualification phase can reveal problems and is a mandatory step to avoid installing
non-compliant flooring/footwear systems.
It is no trivial matter to properly interpret system level test results on high-speed boards. Board manufacturers (OEMs) assess the ESD robustness of their system by means of gun testing, not always in accordance with the IEC standard.
Each component in an ESD protected area (EPA) plays a vital part in the fight against electrostatic discharge (ESD). If just one component is not performing correctly, you could harm your ESD sensitive devices potentially costing your company a lot of money.