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Design

Ohm’s Law Also Applies to ESD‑Induced Heat Pulses

Heat flow analysis for semiconductor ESD situations can be approximated to one dimension, and then captured with a generalized Ohm’s Law using a complex impedance. Methods can include time-dependent electrothermal pulses and feedback due to self-heating, with solutions readily carried out on any desktop computer.

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Static Control Flooring in High Reliability Environments

High reliability organizations (HROs) typically implement stringent static control programs to mitigate the risks of catastrophic and/or life-threatening failures. This article describes some of the considerations to consider for static control flooring in these more demanding environments.

System-Level Grounding

Grounding is often viewed from separate points of view - safety, ESD, or EMI.  This article combines all these aspects together so that practitioners can address grounding at the factories and in the laboratories in a comprehensive way.

Caster Contact: The Achilles Heel of ESD Floors

A fully functional ESD floor prevents static generation and provides an effective path to ground for personnel and equipment. Many conductive and dissipative floors meet STM 7.1 resistance parameters in ANSI/ESD S20.20 but fail to provide adequate electrical contact for grounding equipment with conductive casters and drag chains.
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The Importance of Considering RF Suppression Techniques Early in Design

This article briefly describes why it's important to consider what RF suppression/filtering techniques will be applied to your product as early in the design process as possible.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the fourth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.

Batteries Gone Wrong: Assessment, Mitigation, and Expectations

Modern lithium batteries require a comprehensive approach to risk assessment and mitigation during product development, and a swift and systematic response when safety concerns arise in the field.

Pre-layout Signal Integrity/Power Integrity Simulation Software Expectations

This article briefly describes the most important pre-layout elements to look for when selecting a SI/PI software simulation package.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the third article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.
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