Design

This article focuses on methodology, techniques, and tools to identify, classify, and quantify ESD occurrences in back-end semiconductor and electronics assembly manufacturing.

The Future of EMC Engineering: Locating RF Energy on a Printed Circuit Board

Everything we work with is analog. With this said, how do those who are comfortable with wave propagation (RF) and only work with spectrum analyzers identify and solve an EMC event?

A Dash of Maxwell’s: A Maxwell’s Equations Primer – Part 2: Why Things Radiate

In this chapter, Dash makes the modifications to Maxwell’s Equations necessary to encompass the “dynamic” case, that is, where magnetic and electric fields are changing.

Time-Saving Effects of FFT-Based EMI Measurements

EMI measurements for RF/microwave testing are complex and time-consuming. While signal processing advancements help, key improvements come from enhanced software, integration, automation, and time-domain techniques like FFT, making the EMC measurement process faster and more efficient.

S-parameter Data Correction Using Time Domain Gating for PCB and Cable Applications

This paper describes how to remove the measurement artifacts caused by discontinuities in high frequency S-parameter data caused by the test connectors on the Printed Circuit Boards (PCBs) and cables. The frequency domain S-parameters are converted to the time domain to get the impulse response. Time domain gating is then used on this impulse response to remove reflections due to end connectors and/or other discontinuities. The gated impulse response is then transformed back to the frequency domain. The final result is a much improved S-parameter data set with unwanted resonance removed, allowing the PCB trace or cable loss to be determined.

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Design

Circuit Design

Components and Materials

Electrical Safety

Electromagnetic Compatibility

ESD Control

Printed Circuit Boards

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