In Part 1 of this two-part article, we’ll discuss the development of “grounding networks” and the shift to meshed structures to reduce damage from overvoltages. Part 2 will appear in our November 2020 issue.
Robust ESD protection does not ensure that IC designs are protected from unintended EOS effects. This article identifies areas of risk in some ESD design methods.
OEMs are moving toward the digitalization of the design and integration of electrical and electronic systems in aerospace applications. This approach to design development may help aerospace OEMs avoid possible calamities in the future.
This article highlights key concepts to designing electrostatic discharge (ESD) protection circuits for radio frequency (RF) and millimeter wave applications. Needed RF concepts are discussed and some popular protection schemes are illustrated.
TCAD simulation can identify ESD relevant effects and the internal operation of a device under ESD stress conditions that are not generally accessible through conventional measurement techniques. TCAD simulation can help to reduce IC and device design cycle times, resulting in the more timely introduction of innovative products to market.
The risks of product liability sometime affect technological developments in hardware and software used to make products. They can stifle innovation and make some advancements seem too risky. How does the law view these products and what can be done to evaluate and reduce these risks.
In this article, the author will identify two major types of single-conductor structure resonances and describe some case studies for both. He will then describe how design projects can quickly and easily be ‘de-risked’ from the possibilities of suffering either type of resonance by the use of low-cost field and circuit simulators and/or low-cost bench testing on physical ‘mock-ups’.