There are many books and other reference materials available that describe proper printed circuit board (PCB) layer stack-ups to achieve EMC compliance (see References and Further Reading section located at the... Read More...
This article addresses two very common questions involving two interrelated and specialized sub-fields within the realm of compliance engineering.
Should the reference (i.e., ground) plane be split into two separate sections and a ferrite bead installed between them to prevent unwanted radio frequency emissions? Let’s examine why this practice is not a good idea and should be avoided at all costs.
A common question in new product development is, “How do I properly ground the heatsink?” As a practicing compliance professional, this is an important question to have at least an idea of how to respond.
Discover the most important post-layout elements when selecting a SI/PI software simulation package.
A common problem experienced by novice oscilloscope users is the inability to effectively capture signals we're trying to measure.
To learn more about leadership, the author read as many leadership books as he could for one year. He planned to learn what the latest leadership best practices were and become a more effective leader at the end of it all, or at least be set up to become a better leader as time progressed.
If you think you’re ever going to need to use flexible RF absorber sheets to help your product pass emissions, even at some later date, it might be a good idea to have already identified and obtained the material and have characterized its insertion-loss performance.
The calculation of creepage and clearance distances (spacings) is one of the most important activities a product safety/compliance engineer or technician performs throughout the product development process.
This article briefly describes the concept of the synergy of filtering and shielding and why knowing it is important.