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Electronic Engineering Terms & Definitions

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  • Term
    Definition
  • This standard establishes performance limits for bags that are intended to protect electronic parts and products from damage due to static electricity and moisture during common electronic manufacturing industry transport and storage applications.
  • This Standard provides administrative, technical requirements and guidance for establishing, implementing and maintaining an ESD Control Program.
  • This standard describes the packaging material properties needed to protect electrostatic discharge (ESD) sensitive electronic items, and references the testing methods for evaluating packaging and packaging materials for those properties. Where possible, performance limits are provided.(...)
  • This Standard Practice provides test methods and procedures for periodic verification of the performance of air ionization equipment and systems (ionizers).
  • This standard practice provides a test fixture example and procedures for performance verification of air ionization used in confined spaces where it may not be possible to use the test fixtures defined in ANSI/ESD STM3.1 or ANSI/ESD SP3.3. 
  • This standard practice defines an alternative test method to perform Human Body Model or Machine Model component level ESD tests when the component or device pin count exceeds the number of ESD simulator tester channels. This standard was revised and replaced by ANSI/ESD SP5.2.1-2012.
  • This standard practice defines an alternative test method to perform Human Body Model or Machine Model component level ESD tests when the component or device pin count exceeds the number of ESD simulator tester channels. This standard was revised and replaced by ANSI/ESD SP5.2.2.
  • This standard practice defines an alternative test method to perform Machine Model component level ESD test when the component or device pin count exceeds the number of ESD simulator tester channels. 
  • This standard practice defines an alternative test method to perform Machine Model component level ESD test when the component or device pin count exceeds the number of ESD simulator tester channels.
  • This standard practice provides a test method for generating a Socketed Device Model (SDM) test on a component integrated circuit (IC) device.
  • Establishes guidelines and standard practices presently used by development, research, and reliability engineers in both universities and industry for VF-TLP testing. This document explains a methodology for both testing and reporting information associated with VF-TLP testing.
  • Establishes the procedure for testing, evaluating, and classifying the ESD sensitivity of components to the defined HMM.
  • This Standard Practice provides procedures for evaluating the electrostatic environment associated with automated handling equipment.
  • This standard practice was developed to provide guidance to designers, manufacturers, and calibration facilities for verification and specification of the systems and fixtures used to measure simulator discharge currents. This standard is no longer published.
  • This document provides test procedures for measuring the intrinsic electrical resistance of gloves and finger cots as well as their electrical resistance together with personnel as a system.
  • Provides test methods for measuring the electrical resistance of garments used to control electrostatic discharge. It covers procedures for measuring sleeve-to-sleeve and point-to-point resistance.
  • Test methods and procedures for evaluating and selecting air ionization equipment and systems are covered in this standard. The document establishes measurement techniques to determine ion balance and charge neutralization time for ionizers.
  • Provides a test method to measure the electrostatic charge dissipation characteristics of worksurfaces used for ESD control. The procedure is designed for use in a laboratory environment for qualification, evaluation or acceptance of worksurfaces.
  • Establishes a test procedure for evaluating the ESD sensitivity of components to a defined Machine Model (MM). The component damage caused by the Machine Model is often similar to that caused by the Human Body Model, but it occurs at a significantly lower voltage.
  • This document pertains to Transmission Line Pulse (TLP) testing techniques of semiconductor components. The purpose of this document is to establish a methodology for both testing and reporting information associated with TLP testing.

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