Tagged thermal interface material low modulus TIM

thermal interface material low modulus TIM

New Low Resistance TIM from Fujipoly Delivers 6.0 W/m°K Performance

Fujipoly announced the introduction of Sarcon® GR45A-00, a very low modulus thermal interface material with a low thermal resistance. This new formulation completely fills air gaps between components, board pro... Read More...

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New Low Resistance TIM from Fujipoly Delivers 6.0 W/m°K Performance