testing

How can we provide a quantitative measure of ESD robustness but control the rising test times while preventing major overstress and wear out from thousands of ESD strikes per IC?

This article focuses on the current probes used in EMC measurements and testing.

High-current grounding impedance tests have been specified in safety standards for many years. There are two, independent sources for these tests.

Charged device model (CDM) ESD is considered today to be the primary real world ESD model for representing ESD charging and rapid discharge and is the best representation of what can occur in automated handling equipment used in manufacturing and assembly of integrated circuits (IC) today.

The charged device model describes the electrostatic discharge (ESD) event that occurs when an integrated circuit (IC) is rapidly charged or discharged through a single pin to a metallic surface.

Transmission Line Pulse testing is the default method for characterizing the behavior of devices under ESD circumstances.

Fully anechoic rooms (or FARs) are now included as certified test sites in the generic standard CISPR 16-1-4 Ed 3.2. Although limitations exist for floor standing equipment, they significantly reduce cost and facility requirements for many products.

Consider a spherical capacitor consisting of two concentric, conducive spheres separated by a dielectric.

This article documents the role of margin demonstration in system-level EMC testing: how and why they were first instituted, and how they have evolved over time.

This article will define the test requirements, and discuss the methods used to obtain results. Limitations of the equipment used will also be discussed, so that lab personnel can be made aware and do their best to minimize tolerance errors.