test methodology

Can Mechanical Movements on FI‑CDM Tester Cause Additional Zap During CDM Stress?

Secondary discharges during Field-Induced CDM testing aren't just measurement anomalies—they're real stress events caused by mechanical bouncing of the pogo pin. This groundbreaking investigation reveals how contact vibrations trigger unintended zaps with opposite polarity, provides electrical proof of the mechanism, and offers practical solutions to prevent this hidden reliability threat.

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