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UL Standards Update: March 16-31

Underwriters Laboratories has announced the availability of the following standards, revisions and bulletins.  For additional information regarding the standards listed below, please visit their websi... Read More...
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UL Standards Update: March 1-15

Underwriters Laboratories has announced the availability of the following standards, revisions and bulletins.  For additional information regarding the standards listed below, please visit their websi... Read More...
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UL Standards Update: February 16-28

Underwriters Laboratories has announced the availability of the following standards, revisions and bulletins.  For additional information regarding the standards listed below, please visit their websi... Read More...

ESD Standards: An Annual Progress Report

With the destabilization of the economy, many companies are looking for ways to increase profits and performance within their particular industry. The electronics industry is no exception. Many electronics companies are working towards improved quality and reliability at the same rate as improving the performance of the products they manufacture.

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UL Standards Update: February 1-15

Underwriters Laboratories has announced the availability of the following standards, revisions and bulletins.  For additional information regarding the standards listed below, please visit their websi... Read More...
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Telcordia Standards Update: January 2010

Telcordia has announced the release of the following standard.  For additional information please visit the Telcordia website at www.telcordia.com. GR-82, Issue 13, Signaling Transfer Point (STP) Generic Requir... Read More...
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The ESD Association and JEDEC Collaborate on Standards Development for Harmonized Electrostatic Discharge Test Methods

In September 2006, a small group of ESD control and design stakeholders assembled in a small conference room at the LaPaloma Resort in Tucson, AZ to discuss how the ESD Association (ESDA) and the JEDEC Solid State Technology Association (JEDEC) might harmonize some of their key device (component level) standards documents. Some of the stakeholders involved in those initial discussions (and similar meetings over the next six months) were integrated circuit manufacturers, integrated circuit test manufacturers, original equipment manufacturers, integrated circuit test service providers, and representatives from the ESDA and JEDEC. This first meeting was somewhat extraordinary as these industry stakeholders were able to bring JEDEC and the ESDA to the same table to start working on the harmonization efforts after other previous attempts failed. The key individual sponsoring this meeting was Kay Adams, the ESDA President in 2006-2007.

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European Update: CE Labeling Directive Formalizes Requirements

Since the implementation of the “New Approach” and the CE Marking in the European Union, the requirements for device labeling have evolved, been reviewed, variously implemented and not uniformly enforced. A closer look at post-market compliance is an evolving trend across many economies. Discussions in the European Union, North America and the Asia-Pacific Economic Cooperation (APEC) continue to focus on post-market surveillance and enforcement. One area of scrutiny, particularly in Europe is device labeling.

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IEC Standards Update: January 2010

The International Electrotechnical Commission (IEC) has announced the availability of the following new standards and documents. For additional information regarding the standards listed below, please visit the... Read More...