This article focuses on methodology, techniques and tools to identify, classify and quantify ESD occurrences in back-end semiconductor and electronics assembly manufacturing. Proper methodology of detecting and measuring ESD Events in working tools handling ESD-sensitive components, identifying CDM-type of discharges and associating discharges with the specific steps of the process is described in details on a level usable to a wide range of specialists. Use of tools, such as high-speed storage oscilloscopes, special antennae, ESD detectors and monitors will be explained in detail. This article should benefit increasing numbers of process engineers who are struggling to maintain yield while the devices are getting increasingly more and more ESD-sensitive.
