Scott Mee

Discover how a unique collaboration between Grand Valley State University and E3 Compliance creates exceptional learning opportunities in EMC and high-speed electronics. Learn how students gain hands-on industry experience through co-op programs, research projects, and real-world testing, preparing them for successful careers in electromagnetic compatibility.

This is the second article of a two-article series devoted to the return current distribution in a PCB microstrip line configuration.

This is the first article of a two-article series devoted to the return current distribution in a 2-layer FR-4 PCB microstrip line configuration with a solid reference plane.

This month’s column is the last of three parts devoted to designing, testing, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.

This is the second of three articles devoted to the design, test, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.

This is the first of three articles devoted to the design, test, and electromagnetic compatibility (EMC) immunity evaluation of multilayer PCBs containing analog circuitry. In this study, there are seven design variants that all contain a similar schematic but implement different PCB layout techniques.

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.

This is the eighth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques [1-7].

This is the seventh column in a series devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques .