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printed circuit boards

Practical Engineering: Material Group Selection and How it Affects Spacings

Often overlooked during the development of appropriate spacings (creepage distances) for safety-certified products is the failure to account accurately for the material group of the components involved. This oversight can have significant implications. Let us briefly explore this issue to raise awareness among readers.

Crosstalk Between PCB Traces – Time and Frequency Domain Measurements, Part 2

In this article, we investigate the impact of a guard trace on crosstalk reduction and present measurements taken with the latest‑generation PCB, both in time and frequency domains.

Crosstalk between PCB Traces – Time and Frequency Domain Measurements, Part 1

This article is the first of a two-article series devoted to the topic of crosstalk between PCB traces. In Part 1 of the series, we vary circuit topology, i.e., the distance between traces and the distance to the ground plane.

Practical Engineering: Creepage Distance of an Optocoupler

This month's blog is pulled from the product safety playbook. It highlights a potential issue to avoid when considering an optocoupler's creepage distance when placed onto a printed circuit board (PCB).

Do Measurements Validate Simulations?

It is common for people doing simulations to make a measurement of a similar set up to validate the simulation. The real issue is whether the tool user understands the problem well enough to capture the important features, and whether the user understands the tool well enough to use it correctly.
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Local PCB Layout Tweaks for Improved Signal Integrity When Using ESD Protection Devices

This article describes a practical way to improve signal integrity of typical interfaces on the PCB when using external ESD devices.

Return-Current Distribution in a PCB Microstrip Line Configuration, Part 2

This is the second article of a two-article series devoted to the return current distribution in a PCB microstrip line configuration.

Return-Current Distribution in a PCB Microstrip Line Configuration, Part 1

This is the first article of a two-article series devoted to the return current distribution in a 2-layer FR-4 PCB microstrip line configuration with a solid reference plane.

Most Important PCB Layer Stack-up Considerations That Achieve Optimal EMC Performance

There are many books and other reference materials available that describe proper printed circuit...

Use of Ferrites in PCB Reference Planes

Should the reference (i.e., ground) plane be split into two separate sections and a ferrite bead installed between them to prevent unwanted radio frequency emissions? Let’s examine why this practice is not a good idea and should be avoided at all costs.
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