The mirror technique is a very old technique to be used with PCBs when failing in radiated EMC tests. An easy solution to avoid changes in layout if the technique can be applied to your product.
Software tools can give the EMC engineer a better chance to pass EMC requirements the first time.
It is very common for people doing simulations to make a measurement of a similar set up to validate the simulation. This is a reasonable precaution since modern simulation tools will give a very accurate answer to whatever question it is asked.
Discover the eye diagram, a very useful visual tool to analyze the quality of your connections in digital and high frequency applications.
The International Electrotechnical Commission (IEC) has released IEC 61249-2-43:2016. This standard describes "Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base mate... Read More...
AVX Corporation has launched the new FRC Series medium power DC-link film capacitors, which feature a wide range of capacitance and voltage values in addition to self-healing properties. Designed for use in DC ... Read More...
Global Connector Technology introduces Vertical Micro USB Connectors with longer leads for thicker PCB’S
Global Connector Technology (GCT) has recently introduced thru hole A/B type Micro USB connectors with .090” leads suitable for .062” PCB thickness. Building on the popularity of the existing range the connecto... Read More...
There may be a better use for PCB planes than to just distribute power, namely to provide shielding.
Many sources recently have reported that electrical failures to components previously classified as EOS (Electrical Overstress) are instead the result of ESD (Electrostatic Discharge) failures due to charged-board events (CBE) [1,2]. A charged printed circuit board assembly stores substantially more charge than a discrete device as its capacitance is larger. A subsequent discharge of the board assembly results in increased current for that event - versus that of the discrete component. Consequently, a device’s CDM (charged device model) rating is lowered when mounted in a printed circuit board (PCB). In an attempt to get a feel for just how much it is lowered, we conducted CDM stress tests on components in discrete form, and again after insertion into larger and larger sized pc boards. We found that the CDM ratings are lowered dramatically!
In the past EMC Engineers have relied on metallic enclosures to contain electromagnetic fields and meet radiated emissions limits in military and consumer products. Modern commercial electronics products typically use molded plastic enclosures since they are considered to be aesthetically more pleasing than a metal enclosure, but also to save weight and cost.