printed circuit assembly

The International Electrotechnical Commission (IEC) has released IEC 61189-5-1:2016. This includes "Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies."

Although the foundation of a failure analysis is rooted in science, there is also an art to completing one, successfully. The path from “problem discovery” to “problem solution” has many bumps and twists along the way and this article will hopefully help guide you on your journey.