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Impact of PCB Via and Trace Geometry on the Effectiveness of Decoupling Capacitors, Part 1

Explore how PCB via and trace geometry influence the real‑world effectiveness of decoupling capacitors. This first article in the series defines six board variants, capacitor placement strategies, and PCB topologies, setting the stage for upcoming RF emission results based on CISPR 25 testing.

Post-layout Signal Integrity/Power Integrity Simulation Software Expectations

Discover the most important post-layout elements when selecting a SI/PI software simulation package.

Pre-layout Signal Integrity/Power Integrity Simulation Software Expectations

This article briefly describes the most important pre-layout elements to look for when selecting a SI/PI software simulation package.

Skin Effect and Surface Currents

Understanding skin effect and surface currents saves us a lot of time and cost in the design of our product’s shielding and filtering, especially for tough EMC standards such as automotive, military or aerospace.

Book Review: Power Integrity by Steven Sandler

I’ve often wondered why some harmonic emissions were unrelated to obvious clock oscillators, system...
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