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PCBs

How to Measure Spacings on a Printed Circuit Board to Ensure Safety

This blog by Don MacArthur discusses how to measure creepage and clearance distances on printed circuit boards (PCBs) to ensure safety. It covers definitions, design guidelines, measurement techniques, and tips for compliance engineering in electrical product safety.

Practical Engineering: Material Group Selection and How it Affects Spacings

Often overlooked during the development of appropriate spacings (creepage distances) for safety-certified products is the failure to account accurately for the material group of the components involved. This oversight can have significant implications. Let us briefly explore this issue to raise awareness among readers.

Impact of Decoupling Capacitors and Trace Length on Conducted Emissions in a CMOS Inverter Circuit

The authors evaluate the impact of capacitors and trace length on conducted emissions.

Local PCB Layout Tweaks for Improved Signal Integrity When Using ESD Protection Devices

This article describes a practical way to improve signal integrity of typical interfaces on the PCB when using external ESD devices.

Most Important PCB Layer Stack-up Considerations That Achieve Optimal EMC Performance

There are many books and other reference materials available that describe proper printed circuit...
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Use of Ferrites in PCB Reference Planes

Should the reference (i.e., ground) plane be split into two separate sections and a ferrite bead installed between them to prevent unwanted radio frequency emissions? Let’s examine why this practice is not a good idea and should be avoided at all costs.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the eighth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques [1-7].

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the seventh column in a series devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques .
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