PCBs

Often overlooked during the development of appropriate spacings (creepage distances) for safety-certified products is the failure to account accurately for the material group of the components involved. This oversight can have significant implications. Let us briefly explore this issue to raise awareness among readers.

The authors evaluate the impact of capacitors and trace length on conducted emissions.

This article describes a practical way to improve signal integrity of typical interfaces on the PCB when using external ESD devices.

There are many books and other reference materials available that describe proper printed circuit...

Should the reference (i.e., ground) plane be split into two separate sections and a ferrite bead installed between them to prevent unwanted radio frequency emissions? Let’s examine why this practice is not a good idea and should be avoided at all costs.

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.

This is the eighth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques [1-7].

This is the seventh column in a series devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques .

This article focuses on PCB layout considerations and the design of the reference return paths for the one- and two-layer boards.