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Do Devices on PCBs Really See a Higher CDM-like ESD Risk?

There are several scenarios where integrated circuits (ICs) are mounted on printed circuit boards (PCBs) which might be charged-up and experience CDM-like events.

Failure Analysis: A Road Map

Although the foundation of a failure analysis is rooted in science, there is also an art to completing one, successfully. The path from “problem discovery” to “problem solution” has many bumps and twists along the way and this article will hopefully help guide you on your journey.

Because It’s All About the Current

The paper discusses the importance of understanding the current distribution below a printed circuit board trace.

Exploring the Characteristics of Field Coupled Crosstalk

Interference between circuits is a common occurrence, which is increasingly problematic with our ever condensing technology operating in a wide range of operating frequencies. This interference, known as crosstalk, can be conducted or radiated, and we refer to the circuits generating and receiving this interference as either the source or receptor.

EMI and Signal Integrity: How to Address Both in PCB Design

Let’s do a comparison of EMI (electromagnetic interference) design and signal integrity. EMI focuses...
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Isola’s RF-Substrate Conversion Program Gains Momentum in Partnership With InnoSenT and KSG

Isola Group S.a r.l., a market leader in copper-clad laminates and dielectric prepreg materials...

AVX Launches New DC-Link Film Capacitor Series with Snap-in Terminals for Easy PCB Mounting

AVX Corporation has launched the new FRC Series medium power DC-link film capacitors, which...

Differential Mode to Common Mode Conversion on Differential Signal Vias Due to Asymmetric GND Via Configurations

1406 F3 coverThis article investigates the impact of ground vias placed in close proximity to high speed differential signal vias and the resulting differential mode to common mode conversion. The work shows the influence of the distance between ground (GND) vias and differential signal (Diff. SIG.); the effect of the asymmetrical configuration of the GND vias; the impact of the dielectric thickness and the number of transitions between the planes.

Global Connector Technology introduces Vertical Micro USB Connectors with longer leads for thicker PCB’S

Global Connector Technology (GCT) has recently introduced thru hole A/B type Micro USB connectors...
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