Isola Group S.a r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced a major qualification win in pa... Read More...
AVX Corporation has launched the new FRC Series medium power DC-link film capacitors, which feature a wide range of capacitance and voltage values in addition to self-healing properties. Designed for use in DC ... Read More...
Differential Mode to Common Mode Conversion on Differential Signal Vias Due to Asymmetric GND Via Configurations
This article investigates the impact of ground vias placed in close proximity to high speed differential signal vias and the resulting differential mode to common mode conversion. The work shows the influence of the distance between ground (GND) vias and differential signal (Diff. SIG.); the effect of the asymmetrical configuration of the GND vias; the impact of the dielectric thickness and the number of transitions between the planes.
Global Connector Technology introduces Vertical Micro USB Connectors with longer leads for thicker PCB’S
Global Connector Technology (GCT) has recently introduced thru hole A/B type Micro USB connectors with .090” leads suitable for .062” PCB thickness. Building on the popularity of the existing range the connecto... Read More...
Electromagnetic Interference Shielding Effects in Wireless Power Transfer Using Magnetic Resonance Coupling for Board-to-Board Level Interconnection
In this article, we present the analysis of electromagnetic interference (EMI) shielding effects of wireless power transfer (WPT) using magnetic resonance coupling for board-to-board level interconnection. Board-to-board WPT consists of source coil, receiver coil, and load which are manufactured on printed circuit board (PCB).
PC Board EMI
If properly done, PC board (PCB) design control techniques can be the most cost effective means of resolving EMI issues.
Although the foundation of a failure analysis is rooted in science, there is also an art to completing one, successfully. The path from problem discovery to problem solution has many bumps and twists along the way. This article will hopefully help guide you on that journey.
The board stackup is probably the most essential piece for ensuring a successful PCB design. Modern high-speed busses require controlled-impedance traces, and whether you are using a simulation tool, a simple calculator, or the back of a napkin, you need to understand your manufacturing process to correlate your impedance calculations. This ensures that your trace widths and dielectric heights match what will actually be manufactured, and eliminates last-minute design changes.
Almost every electrical device has a physical structure that contains transmission lines. We call this structure a printed circuit board (PCB). There are three basic structures-rigid, flex and rigid-flex. Advan... Read More...
Many sources recently have reported that electrical failures to components previously classified as EOS (Electrical Overstress) are instead the result of ESD (Electrostatic Discharge) failures due to charged-board events (CBE) [1,2]. A charged printed circuit board assembly stores substantially more charge than a discrete device as its capacitance is larger. A subsequent discharge of the board assembly results in increased current for that event - versus that of the discrete component. Consequently, a device’s CDM (charged device model) rating is lowered when mounted in a printed circuit board (PCB). In an attempt to get a feel for just how much it is lowered, we conducted CDM stress tests on components in discrete form, and again after insertion into larger and larger sized pc boards. We found that the CDM ratings are lowered dramatically!