pcb

Siemens Digital Industries Software announced today that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design. This acquisition strengthens Siemens’ PCB design portfolio and expands its footprint in the electronics small and medium-sized business (SMB) market.

Explore the impact of the return path impedance and the return current level on common-impedance coupling between circuits. The measurements presented were performed on a custom PCB containing audio, video, and high-current circuitry, where the return paths for each circuit were selectively shared with other circuits.

This article is the first of a two-article series devoted to the topic of crosstalk between PCB traces. In Part 1 of the series, we vary circuit topology, i.e., the distance between traces and the distance to the ground plane.

It is common for people doing simulations to make a measurement of a similar set up to validate the simulation. The real issue is whether the tool user understands the problem well enough to capture the important features, and whether the user understands the tool well enough to use it correctly.

This is the second article of a two-article series devoted to the return current distribution in a PCB microstrip line configuration.

This is the first article of a two-article series devoted to the return current distribution in a 2-layer FR-4 PCB microstrip line configuration with a solid reference plane.

Most EMI issues are caused by a resonance that is excited somewhere in the system. It may be a resonance of a cable acting as an antenna or a heatsink energized by the power electronics switches bolted to it, becoming a good radiator. In this article, we look at the indicators that signal the presence of structural resonances and provide techniques for fixing the EMI issues. Practical case studies are presented to demonstrate the techniques.

Should the reference (i.e., ground) plane be split into two separate sections and a ferrite bead installed between them to prevent unwanted radio frequency emissions? Let’s examine why this practice is not a good idea and should be avoided at all costs.

This month’s column is the last of three parts devoted to designing, testing, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.

This is the second of three articles devoted to the design, test, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.