Should the reference (i.e., ground) plane be split into two separate sections and a ferrite bead installed between them to prevent unwanted radio frequency emissions? Let’s examine why this practice is not a good idea and should be avoided at all costs.
This month’s column is the last of three parts devoted to designing, testing, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.
This is the second of three articles devoted to the design, test, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.
This is the first of three articles devoted to the design, test, and electromagnetic compatibility (EMC) immunity evaluation of multilayer PCBs containing analog circuitry. In this study, there are seven design variants that all contain a similar schematic but implement different PCB layout techniques.
This article discusses the distribution of a PCB return current underneath top trace for the microstrip configuration. Next month’s article will discuss the distribution for the stripline configurations.
This article provides insight into how shielding is used in product development, in particular the effectiveness of shielding when it is applied at the PCB level.
This article investigates the impedance of the three standard passive circuit components (R, L, and C) as well as the frequency response of a PCB trace.
When routing a printed circuit board (PCB), try to avoid critical signals in emissions or immunity close to the edge of the board to create a more robust system for EMI and EMC.
Low-cost designs are often an underserved and challenging part of a layout engineer’s career and getting increasingly complicated.
This article uses a classical circuit-theory model of a series RLC circuit to explain the phenomenon of ringing on a transmission line, or a PCB trace.