This is the first of three articles devoted to the design, test, and electromagnetic compatibility (EMC) immunity evaluation of multilayer PCBs containing analog circuitry. In this study, there are seven design variants that all contain a similar schematic but implement different PCB layout techniques.
This article discusses the distribution of a PCB return current underneath top trace for the microstrip configuration. Next month’s article will discuss the distribution for the stripline configurations.
This article provides insight into how shielding is used in product development, in particular the effectiveness of shielding when it is applied at the PCB level.
This article investigates the impedance of the three standard passive circuit components (R, L, and C) as well as the frequency response of a PCB trace.
When routing a printed circuit board (PCB), try to avoid critical signals in emissions or immunity close to the edge of the board to create a more robust system for EMI and EMC.
Low-cost designs are often an underserved and challenging part of a layout engineer’s career and getting increasingly complicated.
This article uses a classical circuit-theory model of a series RLC circuit to explain the phenomenon of ringing on a transmission line, or a PCB trace.
The mirror technique is a very old technique to be used with PCBs when failing in radiated EMC tests. An easy solution to avoid changes in layout if the technique can be applied to your product.
This article discusses the crosstalk reduction between PCB traces by utilizing a guard trace between the traces and investigating the effect of the guard trace grounding.
Consider a two-sided PCB with a single trace on top and full copper ground plane on the bottom.