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Nick Koeller

Common-Impedance Coupling

Explore the impact of the return path impedance and the return current level on common-impedance coupling between circuits. The measurements presented were performed on a custom PCB containing audio, video, and high-current circuitry, where the return paths for each circuit were selectively shared with other circuits.

Estimating the Parasitics of Passive Circuit Components

This article presents a simple method of estimating the parasitics of the three passive circuit components (R, L, C).

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the eighth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques [1-7].
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Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the seventh column in a series devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques .

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This article focuses on PCB layout considerations and the design of the reference return paths for the one- and two-layer boards.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the fifth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the fourth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the third article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.
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