Multi-Chip Modules

A new discharge current sensor installed directly inside an assembly machine captures real ESD events during pick and place operations for the first time. Award winning research reveals how tool speed and moving path change discharge current, giving MCM and SiP designers data to target protection precisely.

Real-world ESD discharge currents during semiconductor assembly differ dramatically from standard test predictions. A new Discharge Current Sensor reveals that actual currents are lower but faster than expected, challenging current protection designs for Multi-Chip Modules and Systems in Package.