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Die-to-Die ESD Discharge Current Analysis

Award-winning research reveals that advanced chip assembly faces unique ESD risks as dies stack closer together. 3D electromagnetic modeling shows discharge currents can exceed 2 amperes in picoseconds, potentially damaging sensitive die-to-die connections despite controlled cleanroom environments.

Increasing Correlation of Testing of Battery and Fuel Cell Powered Systems with Their Real-World Applications

Using established circuit analysis techniques and new capabilities in modeling/simulation tools can improve the understanding of battery and fuel cell powered system performance.

Qualification of Interface IP for Charge Device Model Based on Peak Current

The voltage based CDM classification has practically no meaning for IP qualification. In this article, we propose an alternative CDM qualification, which is based on a peak current criterion.

Developing and Modeling a Simulation Framework for Common EMC Topics

Modeling and simulation is a complex topic, usually left to experts of the EMC field as the amount of knowledge and understanding that goes into creating a model can be tremendous.

View from the Chalkboard

By the time you read this, I will have completed my Fall semester undergraduate...
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Artec scanners used by Hyundai Europe to create and modify automobile seats

Artec has announted that two of their scaners are being used by Hyundai Motor...

Assessing the EMC Performance of PCB Shields by Electromagnetic Modeling

In the past EMC Engineers have relied on metallic enclosures to contain electromagnetic fields and meet radiated emissions limits in military and consumer products. Modern commercial electronics products typically use molded plastic enclosures since they are considered to be aesthetically more pleasing than a metal enclosure, but also to save weight and cost.

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