Marko Simicic

ESD Challenges in 2.5D/3D Integration

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

The Transistor: An Indispensable ESD Protection Device – Part 1

Nowadays in the semiconductors industry, the bipolar transistor is massively used for various functions in modern integrated circuits (ICs) products.

Indium-gallium-zinc-oxide (IGZO) Thin-film-transistors (TFT) and ESD

The thin-film transistor (TFT) became commercially available slightly more than 30 years ago in the form of a switch for the Liquid Crystal Display.

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UL Solutions to Open Advanced Battery Laboratory

FDA Releases Reports on Medical Device Safety Initiatives

Military and Aerospace EMC: Portable Electronics Onboard Aircraft – Part 1

Element Joins the 5G Automotive Association

FCC to Vote on Restoring Net Neutrality

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