• News
  • Design
  • Test & Measure
  • Compliance
    • Standards Guidance
    • Standards Library
  • Career
    • Professional Development
    • Events
  • Industry
  • Magazine
    • In This Issue
    • Past Issues
    • Subscribe
Search
In Compliance Magazine logo
  • News
    Random
    • Tiny Radio Chip | In Compliance Magazine

      Engineers Develop Tiny Radio Chip Powered by Electromagnetic Waves

    Recent

    • NIST Extends Deadline for Comments on Strategy for Critical and Emerging Technology

    • FCC Explores Increasing Minimum Speed Benchmark for Broadband

    • MedTech Europe Offers Its Vision for the Future of MedTech Regulations

    • Engineering News
    • Global Compliance News
    • Industry News
    • You Can’t Make This Stuff Up
  • Design
    Random
    • 1109_F1_fig1

      Digital “Noise” Common-mode Coupling Mechanisms in the Z-Axis

    Recent

    • ESD Co-Design for High-Speed SerDes in FinFET Technologies

    • GaN/SiC Transistors for Your Next Design: Fight or Flight?

    • Local PCB Layout Tweaks for Improved Signal Integrity When Using ESD Protection Devices

    • Clock Duty Cycle Tuning for Desense Mitigation in Modulation‑Involved Cases

    • ESD Designers’ Headache with Multiple Automotive Test Requirements, Part I

    • Troubleshooting EMI Issues Caused by Structural Resonances

  • Test + Measure
    Random

    • Troubleshooting Radiated Emissions: Three Case Studies

    Recent

    • GaN/SiC Transistors for Your Next Design: Fight or Flight?

    • (Re)Discovering the Lost Science of Near-Field Measurements, Part 4

    • (Re)Discovering the Lost Science of Near-Field Measurements, Part 3

    • Pre-Compliance EMI Testing

    • (Re)Discovering the Lost Science of Near-Field Measurements, Part 2

    • In-Situ Radiated Emission Testing of Large Systems Installations

  • Standards
    Random

    • New Edition of IEC 62196-3 Published

    Recent

    • ANSC C63 Committee on EMC: A 2023 Status Report

    • An Overview of Aerospace Battery Compliance

    • The Future of Wi-Fi

    • Standards Articles
    • Standards Library
      • EMC Standards
      • Energy Standards
      • ESD Standards
      • Safety Standards
      • SmartGrid Standards
    • Standards Updates
  • Fundamentals
    Random
    • 1102_F1_table4

      EMC in Military Equipment

    Recent

    • NASA Space Shuttle’s Return to Flight: The Untold Electromagnetic Backstory

    • Continuing Your Professional Education in 2022

    • A Recipe for Success: How to Grow from EMC Novice to EMC Expert

    • Capacitors: Theory and Application

    • Ohm’s Law Also Applies to ESD‑Induced Heat Pulses

    • RF Tech Tip: BNC Versus Threaded Connectors

  • Resources
    • Resource Library
    • Career
    • Event Calendar
    • The Directory
    • Terms & Definitions
  • Magazine
    • Subscribe
      • In Compliance Magazine
      • eNewsletters
      • Renew your Subscription
    • Issue Archive
      • Current Issue
      • Past Issues
    • Columns
      • Banana Skins
      • EMC Concepts Explained
      • Hot Topics in ESD
      • Mr. Static
      • On Your Mark
      • Practical Tips
      • Product Insights
      • Questions To Ask
      • Technically Speaking
      • Reality Engineering
      • Selection Tips
      • Troubleshooting EMI Like a Pro
      • The View from the Chalkboard
Breaking
  • NIST Extends Deadline for Comments on Strategy for Critical and Emerging Technology
  • FCC Explores Increasing Minimum Speed Benchmark for Broadband
  • MedTech Europe Offers Its Vision for the Future of MedTech Regulations
  • Decoding the Invention of the Radio
  • Subscribe
  • Contribute
  • Advertise
  • Directory
  • About

Tagged Intel

Home
Intel
Averna

Intel Chooses Averna for Testing DOCSIS 3.1 Chipsets

Averna, an industry-leading developer of test solutions and services for communications and electronics device-makers worldwide, announced today that Intel has selected Averna’s DP-1000 DOCSIS® Protocol Analyze... Read More...
x-ray-scattering

X-ray Scattering Measures Nanoscale Chip Details

An example CDSAXS scattering pattern (left) shows the interference patterns created by the shape of the nanostructure, which ultimately yield a "best fit" shape model (top, right). The corresponding cross-sect... Read More...

Micron and Intel Announce 3D NAND Flash Memory

Micron and Intel announced a new high-density flash memory technology called 3D NAND that can be used for storage inside laptops and mobile consumer devices. In this new architecture, memory cells are stacke... Read More...

Get the Current Issue

November 2023

Get the Digital Edition

In Compliance is a leading source of news, information, education, and inspiration for electrical and electronics engineering professionals.

 

Visit our benefactors:

Browse by Industry

Aerospace
Automotive
Communications
Consumer Electronics
Education
Energy & Power
Industrial
Information Technology
Medical
Military & Defense

Latest Engineering News

  • Decoding the Invention of the Radio

  • Individuals in Engineering and Technology Recognized for STEM Achievements & Community Contributions

  • U.S. DoE to Provide Nearly $3 Billion for EV Battery Development, Manufacturing

  • Wirelessly Powering IoT With 5G Network

  • Polymer Film Can Limit Electromagnetic Interference

© 2009-2023 Same Page Publishing. All rights reserved.
  • Contact Us
  • Privacy Policy
  • Terms of Use
  • Change of Address
  • Cancel Subscription
X