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Market-driven Standardization and IEEE 802.3™ Ethernet Innovation

1403 ethernet-innovation coverEthernet’s success in the marketplace is undeniable, and market-driven standardization has been instrumental in its success. It’s a cycle of synergistic innovation and market growth that has been spinning for decades. Ethernet has become entwined with almost every pattern and process of every-day life around the world. Whether a personal computer (PC) has a direct connection to a router or an indirect connection through a “Wi-Fi®” access point, it is highly likely that Ethernet is providing the connection to the Internet.

Two New Standards-Development Projects Started to Improve Smart Grid Fault Management and Other Functionality

The IEEE has recently approved two new projects to advance the standardization of phasor data concentrators (PDCs) with standards to improve fault management and other smart grid functionality.

“I Spy Ethernet IEEE 802.3™” Contest Winner Announced

The IEEE Standards Associated has announced the winner of their “I Spy Ethernet IEEE 802.3™” contest, Rahul Kar, an IT student from Calcutta, India. Mr. Kar’s submission represented smart cities based on the Internet of Things.

New IEEE 802.11ac Specification Approved Due to the Need for Higher, Multi-User Throughput in Wireless LANs

IEEE has approved the IEEE 802.11acTM-20131 specification to achieve higher multi-user throughput in wireless local area networks (WLANs).  This new revision intends to improve WLAN user experience more than 10 times the speed compared to the previous version, with data rates up to 7 Gbps in the 5 GHz band.

IEEE Selects 2014 President-Elect

Dr. Howard E. Michel has been selected as the 2014 IEEE President-elect and will begin his one-year term on January 1, 2014. Dr. Michel is an associate professor of Electrical and Computer Engineering at UMass-Dartmouth and engineering consultant.

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IEEE Approves Standard to Support Smart-Grid Applications

The Institute of Electrical and Electronics Engineers (IEEE) has approved 1901.2 standard to support low-frequency, narrowband power-line communications and smart-grid applications.

Electromagnetic Interference Shielding Effects in Wireless Power Transfer Using Magnetic Resonance Coupling for Board-to-Board Level Interconnection

1311 F3 coverIn this article, we present the analysis of electromagnetic interference (EMI) shielding effects of wireless power transfer (WPT) using magnetic resonance coupling for board-to-board level interconnection. Board-to-board WPT consists of source coil, receiver coil, and load which are manufactured on printed circuit board (PCB).

Fred B. Schneider to Receive 2012 IEEE Emanuel R. Piore Award

Fred B. Schneider, a computer scientist whose foundational work on trustworthy computer systems has...

Raghunath K. Shevgaonkar, Inspirational Electromagnetics Educator, to Receive 2011 IEEE Undergraduate Teaching Award

Raghunath K. Shevgaonkar, one of the most admired professors at the Indian Institute of...

Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures

An experimental validation of an electromagnetic band-gap (EBG) based common mode filter is given in this article. The proposed layout technique is based on planar EBG structures altered by removing the connecting bridges between adjacent patches. The patches are properly dimensioned for ensuring the presence of frequency notches at the frequencies that should be filtered in the common-mode transfer function. The notch frequency is associated with the first resonant mode of the patch.

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