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Harald Gossner

What Exactly is ESD for 3D ICs?

The EOS/ESD Association is addressing the various vectors of development needed to support 3D packaging ESD integration and manufacturing ESD control.

Device Failure from the Initial Current Step of a CDM Discharge

CDM discharges exhibit a fast initial current step when the stray capacitance of the pogo pin is charged. It is demonstrated that the high slew rate can damage sensitive gate oxides. The miscorrelation of CDM and CC-TLP methodologies is addressed by applying pulses with 20 ps rise time.

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