esd

It is a common misconception that designing an IC for system-level ESD requirements simply requires an increase in the capability of the ESD cells, which are already present for safe handling ESD requirements, like Human Body Model (HBM).

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

This article explores the waveform specifications called out in the IEC 61000-4-2 standard.

To provide in-depth coverage of ESD testing methods, in this article, we look at another type of ESD testing based on the “Human Body Model” (HBM) method of ESD testing.

Nowadays in the semiconductors industry, the bipolar transistor is massively used for various functions in modern integrated circuits (ICs) products.

Ethernet solutions have been popular in industrial and computing applications for several decades but were not widely adopted in the automotive area. Automotive ethernet enables fast and robust data communication, with high flexibility in bus topologies for multiple electronic control units (ECUs).

Reliability issues need to be continuously addressed during technology development as technologies further advance into novel transistor structures such as FinFETs and Multi-gate devices.

This is Part 2 of an article describing the difference between the electrostatic discharge (ESD) qualification requirements for automotive and standard commercial integrated circuits.

Integrated circuits intended for automotive applications have higher electrostatic discharge (ESD) qualification requirements than those intended for commercial and consumer electronics.

An AM radio can be useful for finding both radiated emissions and ESD events. Understanding how radio works is essential for engineers to use this low-cost technology to troubleshoot complex EMI issues.