esd

Purdue University's Engineering Education College has selected "SOIC and SOT" as the #1 children's book on its pre-engineering STEM gift-giving guide.

Explore innovations in transistor scaling technology with a focus on backside power delivery networks. This technical analysis examines how extremely thinned silicon substrates impact ESD protection in advanced semiconductor devices, offering solutions for maintaining reliability in next-generation chip designs.

This column explores the significant impact of artificial intelligence on advancements in silicon fabrication, focusing on the development of high bandwidth memory (HBM) and associated die-to-die(D2D) electrostatic discharge (ESD) protection challenges.

This text discusses ESD/ESA control in semiconductor fabs, highlighting challenges with S20.20 certification, the importance of grounding conductive materials, managing insulative materials, and using ionization for charge neutralization in wafer manufacturing processes.

This article discusses the risks of electrostatic discharge (ESD) in healthcare settings and the new ESDA TR29 guidance document. It outlines causes of ESD, potential hazards like equipment malfunction and data loss, and preventive measures such as static control flooring, proper grounding, and humidity control. The article also describes recommended ESD control programs for healthcare facilities.

A Charged Device Model (CDM) simulation method has been demonstrated to predict CDM fail current of receiving circuits with gate oxide connected to pad. This method involves inclusion of 20ps rise time edge into the stimulus. It was shown previously that this fast rise time component of the pulse can cause the gate oxide damage. The simulation method is intended as a schematic-level tool during pre-silicon design phase to deliver CDM ESD protection. Simulation results are verified by silicon results with qualification CDM test on package and Transmission-Line-Pulse (TLP) measurements on wafer-level.

Standards continuously evolve, and EOS/ESD Association, Inc. standards are no different. The ESDA is always striving to achieve the highest quality standards.

Cortec has led the industry in designing two-in-one packaging solutions that meet both needs and today is eager to turn the spotlight on EcoSonic® ESD Paper as a sustainable alternative to standard plastic ESD bags.

The article discusses ESD protection challenges for RF switches in SOI technology. It examines the self-protection mechanism, proposes a behavioral model to simulate ESD response more accurately, and explores predicting failure current levels critical for reliable ESD design.

The new Desco Mini Monitor is the newest generation of ESD continuous monitor. It uses a unique illuminated enclosure to indicate the status of the operator and worksurface.