EOS/ESD Association

Grounding is the foundation of any ESD control program — but doing it right means more than just connecting a wrist strap. This primer covers the key requirements of ANSI/ESD S20.20, common grounding techniques, and what's coming in the next revision of S6.1.

ESD flooring systems fail more often from misunderstanding than bad materials. This article walks through nine common pitfalls — from confusing anti-static with ESD-safe to poor grounding and installation shortcuts — and how to avoid each one.

This column explores two air‑discharge‑based methods for testing small form factor products under the Charged Device Model. It examines limitations of traditional FICDM testers, presents wafer‑level and bare‑die testing approaches, and introduces contact‑first CDM techniques designed to improve reliability for fine‑pitch and low‑voltage devices.

Secondary discharges during Field-Induced CDM testing aren't just measurement anomalies—they're real stress events caused by mechanical bouncing of the pogo pin. This groundbreaking investigation reveals how contact vibrations trigger unintended zaps with opposite polarity, provides electrical proof of the mechanism, and offers practical solutions to prevent this hidden reliability threat.

High-speed automotive serial links supporting ADAS features face a critical challenge: meeting stringent system-level ESD requirements while maintaining signal integrity at 10+ Gbps. This column presents an innovative on-chip protection architecture embedding ESD clamps within T-coil circuits, achieving 8kV ISO protection while supporting data rates exceeding 36 Gbps.Retry

Real-world ESD discharge currents during semiconductor assembly differ dramatically from standard test predictions. A new Discharge Current Sensor reveals that actual currents are lower but faster than expected, challenging current protection designs for Multi-Chip Modules and Systems in Package.

USB-C's high-speed data lines need robust ESD protection, but TVS device placement matters critically. New research reveals why positioning protection behind AC coupling capacitors—not in front—delivers superior IC protection for sensitive SuperSpeed applications.

Traditional Charged Device Model testing falls short for bare dies in 2.5D/3D devices. With discharge currents reaching 500 mA at just 5V, existing methods can't handle the unique challenges of testing unpackaged components. CCTLP emerges as a promising alternative for reliable low-voltage testing.

The ANSI/ESD S20.20 standard has become the cornerstone for developing effective ESD control programs. This standard is essential for safeguarding sensitive electronic components and minimizing failure rates.

This column explores the significant impact of artificial intelligence on advancements in silicon fabrication, focusing on the development of high bandwidth memory (HBM) and associated die-to-die(D2D) electrostatic discharge (ESD) protection challenges.