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emc concepts explained

Transmission Line Reflections at the RL and RC Loads

This article discusses the reflections on a transmission line terminated with either an RL or an RC load.

PCB Return-Current Distribution in the Stripline Configurations

This article discusses the current distribution for the stripline configurations.

PCB Return-Current Distribution in a Microstrip Line

This article discusses the distribution of a PCB return current underneath top trace for the microstrip configuration. Next month’s article will discuss the distribution for the stripline configurations.

Measuring Differential- and Common-Mode Current Radiation from Cables

This article discusses the common-mode and differential-mode radiation from cables and presents the measurement results from the SMPS connecting wires.

Principles of Switched-Mode Power Supply Design for EMC Performance

This article discusses the basics of a step-down (buck) DC Switched-Mode Power Supply (SMPS). It should serve at an entry-level tutorial and a building step towards the more advanced designs.
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Dipole-Type Antennas in EMC Testing: Part II

Part II of this two-article series focuses on log-periodic and biconical antenna impedance, VSWR, and radiated emissions measurements.

Dipole-Type Antennas in EMC Testing

This two-article series is devoted to a dipole family of antennas used in EMC testing: half-wave dipole, quarter-wave monopole, log-periodic, and biconical antenna.

Basic EMC Rules

This article discusses the origins, justification, and interrelations between some of basic EMC rules regarding the highest significant frequency (bandwidth) present in digital signals, definition of the electrically short structures, and the transmission line criterion.

Impact of Decoupling Capacitors and Embedded Capacitance on Impedance of Power and Ground Planes: Part II

We investigate two four-layer PCBs with power and ground plane pairs spaced 3 mils and 30 mils apart.

Impact of Decoupling Capacitors and Embedded Capacitance on Impedance of Power and Ground Planes: Part I

We investigate two four-layer PCBs with power and ground plane pairs spaced 3 mils and 30 mils apart.
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