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IEC Releases New Edition of IEC/TS 61967-3 Test Procedure

A new edition of the test procedure, IEC/TS 61967-3, has been released by the...

Jameco Electronics Celebrates 40th Anniversary, Says “We’re Just Getting Started”

Jameco Electronics kicks off its 40th anniversary celebration by marking the milestone with a...

Ametherm’s SURGE-GARD Line of NTC Inrush Current Limiting Thermistors Now in Stock at Digi-Key

Ametherm announced that global electronic components distributor Digi-Key Corporation is now stocking the company's...

3D Robots Made with Self-Assembling Components

Researchers at MIT have written two different papers that describe the idea of bakable...

Free iOS App for Component Search and Selection from Wurth Elektronik eiSos

Würth Elektronik eiSos has introduced a smartphone app for finding and selecting components using...
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Compact Vibration Table for Testing Small Components From Cincinnati Sub-Zero

Cincinnati Sub-Zero’s (CSZ) new TCB-1.3 benchtop vibration table is ideal for reliability testing of...

New Edition of J1113/26_201404 Published

A new revision of J1113/26 has been published by SAE International. J1113/26 applies to...

America Semiconductor and Quest Components Announce Worldwide Distribution Agreement

America Semiconductor, LLC, a leading manufacturer of state-of-the-industry high-power semiconductors, appointed Quest Components, Inc....

Researchers Develop New Technique to Use Light in Metals to Transmit Information

A team of electrical engineers from the University of Utah have developed microscopic assemblies that use light to transmit information and were produced using an inexpensive inkjet printer.

Gowanda and TTE Join Forces to Grow Electronic Components Business

Gowanda Electronics, a US-based designer and manufacturer of precision electronic components and inductors for...
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