charged device model

Voltage to Current Correlation for CDM Testing

It is now well known that testing for CDM ESD evaluation is becoming a bigger challenge. An alternate approach called capacitively coupled transmission line pulsing (CCTLP) offers advantages over standard field-induced CDM testing.

Product Insights: Charged Device Model ESD Testing

This blog explains CDM ESD testing using the field-induced (FI) method, which is important for semiconductor manufacturers. It covers building a CDM-FI tester, waveform details and verification, and qualification nuances.

Challenges of CDM Modeling for High-Speed Interface Devices

The behavior of ultra-high-speed interfaces is complex, involving fast-rise time waveforms and on-die transient phenomena that cause device failure at lower CDM levels.

Low Voltage Charged Device Model (CDM) Testing at a Crossroads

Most ESD experts consider CDM testing to be the most critical ESD qualification test for modern integrated circuits. ESD control engineers need to know the charged device ESD robustness of all components passing through their manufacturing line. CDM measurements provide that knowledge.

Advances in CMOS Technologies Leading to Lower CDM Target Levels

Can you continue aiming for typical CDM protection levels? Introduction The ESD Design Window (ESD-DW) has...

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Device Failure from the Initial Current Step of a CDM Discharge

CDM discharges exhibit a fast initial current step when the stray capacitance of the pogo pin is charged. It is demonstrated that the high slew rate can damage sensitive gate oxides. The miscorrelation of CDM and CC-TLP methodologies is addressed by applying pulses with 20 ps rise time.

Qualification of Interface IP for Charge Device Model Based on Peak Current

The voltage based CDM classification has practically no meaning for IP qualification. In this article, we propose an alternative CDM qualification, which is based on a peak current criterion.

Next Generation Charged Device Model ESD Testing

The charged device model describes the electrostatic discharge (ESD) event that occurs when an integrated circuit (IC) is rapidly charged or discharged through a single pin to a metallic surface.

Do Devices on PCBs Really See a Higher CDM-like ESD Risk?

There are several scenarios where integrated circuits (ICs) are mounted on printed circuit boards (PCBs) which might be charged-up and experience CDM-like events.

Decreased CDM Ratings for ESD-Sensitive Devices in Printed Circuit Boards

Many sources recently have reported that electrical failures to components previously classified as EOS (Electrical Overstress) are instead the result of ESD (Electrostatic Discharge) failures due to charged-board events (CBE) [1,2]. A charged printed circuit board assembly stores substantially more charge than a discrete device as its capacitance is larger. A subsequent discharge of the board assembly results in increased current for that event - versus that of the discrete component. Consequently, a device’s CDM (charged device model) rating is lowered when mounted in a printed circuit board (PCB). In an attempt to get a feel for just how much it is lowered, we conducted CDM stress tests on components in discrete form, and again after insertion into larger and larger sized pc boards. We found that the CDM ratings are lowered dramatically!

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