bogdan adamczyk Archives - In Compliance Magazine

Shunt Inductive Discontinuity along the Transmission Line and Transmission Lines in Parallel

This article discusses the impact of a shunt inductive discontinuity along the line as well as the effect of feeding two transmission lines in parallel. The analytical results are verified through the HyperLynx simulations and laboratory measurements.

Transmission Line Reflections at a Shunt Resistive and Reactive Discontinuity Along the Line

This article discusses the reflections on a transmission line at a shunt resistive and capacitive discontinuity along the line.

Eye Diagram

This article addresses the impact of driver, HDMI cable, and receiver on signal quality using data eye, based on the following criteria: data eye opening, data mask violation, and data jitter.

Eye Diagram

This is the first of two articles devoted to an eye diagram. In this article, the fundamental definitions and concepts are presented.

Evaluation of PCB Design Options on Analog Signal RF Immunity using a Multilayer PCB

This month’s column is the last of three parts devoted to designing, testing, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.

Evaluation of PCB Design Options on Analog Signal RF Immunity using a Multilayer PCB

This is the second of three articles devoted to the design, test, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.

Evaluation of PCB Design Options on Analog Signal RF Immunity Using a Multilayer PCB

This is the first of three articles devoted to the design, test, and electromagnetic compatibility (EMC) immunity evaluation of multilayer PCBs containing analog circuitry. In this study, there are seven design variants that all contain a similar schematic but implement different PCB layout techniques.

Estimating the Parasitics of Passive Circuit Components

This article presents a simple method of estimating the parasitics of the three passive circuit components (R, L, C).

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.

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