2.5D/3D integration

2.5D/3D Integration Challenges: Bare Die Testing

As chiplets shrink toward 10 micron pitches, standard CDM testers can no longer verify their ESD withstand voltage before 2.5D/3D assembly. This first installment breaks down why existing test methods fall short and maps out the emerging paths, from contact-based CDM to correct-by-design verification, for closing the gap.

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