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Recently Published Standard, IEC 62047-30:2017 for Micro-Electromechanical Devices

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The International Electrotechnical Commission (IEC) has released IEC 62047-30:2017 for “Semiconductor devices – Micro-electromechanical devices – Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film,” and is now available on the IEC webstore.

Description: “IEC 62047-30:2017 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process.

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Why Capacitance? Benefits & Applications of Digital Capacitive Solutions

In this paper, readers will discover digital capacitive displacement measurement solutions not possible with conventional analog systems. The following applications address a wide range of industry sectors.

 

*Description from the IEC Website

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