Recent Standard Update: IEC 61191-2:2017, Printed Board Assemblies

Untitled-3The International Electrotechnical Commission (IEC) has released IEC 61191-2:2017. This standard pertains to Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies and is now available on the IEC webstore.

Description: “IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

This edition includes the following significant technical changes with respect to the previous edition:

a)   the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b)   some of the terminology used in the document has been updated;
c)   references to IEC standards have been corrected;
d)   five termination styles have been added

*Description from the IEC Website.

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