Newly Released IEC 61191-4:2017 for Printed Board Assemblies


The International Electrotechnical Commission (IEC) has released IEC 61191-4:2017. This standard pertains to “Printed board assemblies – Part 4: Sectional specification – Requirements for terminal soldered assemblies,” and is now available on the IEC webstore.

Description: “IEC 61191-4:2017 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).

This edition includes the following significant technical changes with respect to the previous edition: 

The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

*Description from the IEC Website. 

About The Author

In Compliance News

Our news team works diligently to bring you the latest updates and information in world of compliance engineering.

Related Posts

Leave a Reply

Your email address will not be published.