Newly Released IEC 61191-4:2017 for Printed Board Assemblies


The International Electrotechnical Commission (IEC) has released IEC 61191-4:2017. This standard pertains to “Printed board assemblies – Part 4: Sectional specification – Requirements for terminal soldered assemblies,” and is now available on the IEC webstore.

Description: “IEC 61191-4:2017 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).

This edition includes the following significant technical changes with respect to the previous edition: 

The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

*Description from the IEC Website. 

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