A new technique to transfer thin semiconductor films onto arbitrary substrates has been developed at North Carolina State University. This method is quicker than existing techniques and allows the films to be transferred from one substrate to another without creating any cracks.
The researchers use the physical properties of molybdenum sulfide (MoS2), a commonly used material in the semiconductor industry, to transfer the thin film using room temperature water, a tissue, and a pair of tweezers. This new method could lead the way for advances in flexible computing or photonic devices.
