The new SC305 and SL305 series with spring clamp compression mount contacts from METZ CONNECT facilitate a wire-to-board connection without the use of a header. Contact is established directly on the solder pads where a header would traditionally stand, thus allowing designers to use the opposing side of the PCB for components. Lending itself towards product miniaturization, the SC305/SL305 utilizes METZ CONNECT proven Springcon technology for a secure, vibration resistant connection that automatically adjusts to wires ranging in size from 28 to 16 AWG. With a 5mm centerline, solid wires can be directly inserted for a simple, tool-less connection. The SL305 is a direct solder component and the SC305 is a sleek, snap-fit version for traditional wall-plate applications.
Visit the METZ CONNECT website for more information.