Fujipoly introduced a new version of its popular SARCON® SPG-15A, form-in-place thermal interface compound. The new SARCON® SPG-20B formulation is an easy to dispense, low-viscosity thermally conductive silicone that delivers a thermal conductivity of 2.1 W/m°K and a thermal resistance of only 1.8°C cm2/W. This is roughly a 51% improvement in thermal resistance and a 40% improvement in thermal conductivity compared to SPG-15A.
When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps to improve cooling performance. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). The unique physical properties of this silicone compound also allow for excellent vibration absorption and have proven to be an effective thermal solution for both current and emerging higher-frequency electronics applications.
For additional information, visit www.fujipoly.com.
