Get our free email newsletter

New Range of Ultra-High-Density Large PXI Matrix Modules Offer Twice the Density of Competing Modules

Photo Source: Pickering Interfaces
Photo Source: Pickering Interfaces

Pickering Interfaces, a provider of modular signal switching and simulation for electronic test and verification, has introduced their new BRIC™ Ultra-High-Density Large PXI Matrix Range.

The new range of Ultra-High-Density Large PXI Matrix Modules (model 40-559) are robust 1Amp/20W switching modules, with up to 4,096 crosspoints. The matrices are available in 2, 4, or 8-slot PXI sizes and are designed for high-performance matrix requirements.

“These matrices are constructed with Pickering Electronics’, our sister company, new 4mm x 4mm Reed Relays which currently have the highest packing density available,” said Keith Moore, CEO at Pickering Interfaces. “By adding these relays to our BRIC PXI matrices, we now have twice the density of any competing large matrix module for 1Amp switching in PXI.”

- Partner Content -

A Dash of Maxwell’s: A Maxwell’s Equations Primer – Part One

Solving Maxwell’s Equations for real-life situations, like predicting the RF emissions from a cell tower, requires more mathematical horsepower than any individual mind can muster. These equations don’t give the scientist or engineer just insight, they are literally the answer to everything RF.

With their high level of switching density, these PXI matrices allow a complete Functional ATE system to be housed in a single 3U PXI chassis and allow the use of much lower cost 8 or 14-slot PXI chassis’.

The matrices are designed with built-in high-performance screened analog busing to minimize the cost and complexity of cable assemblies to the device under test as well as to instrumentation.

The range includes Pickering’s Built-in Relay Self-Test (BIRST) and is also supported by their eBIRST Switching System Test Tools. These tools provide a quick and simple way of finding relay failures within the modules.

The 40-559 matrices can be used in many industries; however typical applications include automotive ECU and semiconductor package testing. Dual analog bussing for the narrower matrix options, enable completely separate matrices within a single module for parallel testing.

Source:  Pickering Interfaces

Related Articles

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.

Get our email updates

What's New

- From Our Sponsors -

Sign up for the In Compliance Email Newsletter

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.