Get our free email newsletter

New Low Resistance TIM from Fujipoly Delivers 6.0 W/m°K Performance

Fujipoly announced the introduction of Sarcon® GR45A-00, a very low modulus thermal interface material with a low thermal resistance. This new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure. This allows greater surface contact with a heatsink and improves cooling performance.

When placed between a heat source such as a semiconductor and a nearby heat sink, this TIM provides a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk)  and a thermal resistance as low as 1.33°C cm2/W.  Sarcon® GR45A-00 is available in convenient pre-cut sheets up to a maximum size of 200mm x 300mm (max.) and can also be die cut to your exact application specifications. Material thicknesses from 0.5mm to 5.0mm can be specified in 0.5mm increments.

For more information, visit www.fujipoly.com.

- Partner Content -

Antenna Factor and Gain Calculations

Antenna Factor and Gain metrics provide crucial insights into antenna performance, allowing engineers to calculate signal strength relationships and directional effectiveness. These measurements help optimize RF systems by comparing actual antenna behavior to theoretical isotropic radiators using standardized 50-ohm configurations.

Related Articles

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, and check out trending engineering news.

Get our email updates

What's New

- From Our Sponsors -

Sign up for the In Compliance Email Newsletter

Discover new products, review technical whitepapers, read the latest compliance news, and trending engineering news.