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New Low Resistance TIM from Fujipoly Delivers 6.0 W/m°K Performance

Fujipoly announced the introduction of Sarcon® GR45A-00, a very low modulus thermal interface material with a low thermal resistance. This new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure. This allows greater surface contact with a heatsink and improves cooling performance.

When placed between a heat source such as a semiconductor and a nearby heat sink, this TIM provides a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk)  and a thermal resistance as low as 1.33°C cm2/W.  Sarcon® GR45A-00 is available in convenient pre-cut sheets up to a maximum size of 200mm x 300mm (max.) and can also be die cut to your exact application specifications. Material thicknesses from 0.5mm to 5.0mm can be specified in 0.5mm increments.

For more information, visit www.fujipoly.com.

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VSWR Explained

This resource traces VSWR from telegraph linemen using light bulbs to detect transmission line faults to modern RF measurements. It explains how improper line termination creates reflected signals that combine with forward waves, forming standing wave patterns. The evolution demonstrates how VSWR became a standard parameter for measuring reflected power in RF systems.

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