Fujipoly announced the introduction of Sarcon® GR45A-00, a very low modulus thermal interface material with a low thermal resistance. This new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure. This allows greater surface contact with a heatsink and improves cooling performance.
When placed between a heat source such as a semiconductor and a nearby heat sink, this TIM provides a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W. Sarcon® GR45A-00 is available in convenient pre-cut sheets up to a maximum size of 200mm x 300mm (max.) and can also be die cut to your exact application specifications. Material thicknesses from 0.5mm to 5.0mm can be specified in 0.5mm increments.
For more information, visit www.fujipoly.com.