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New Low Profile, Quick Release Interconnect From Amphenol Offers High Performance

Amphenol Industrial Global Operations has introduced a low profile, quick release, high power interconnect using Amphenol’s new R4 RADSOK technology.  The new RADLOK product line provides low insertion and extraction forces with a high mating cycle rating for high power interconnects, making it perfect for frequent mating applications.

This high performance connection system features a versatile, low profile, right angle design making it ideal for use in the automotive, heavy equipment, power/battery storage, hybrid-electric system, power interconnect and factory automation markets.  An integrated positive mechanical lock/release feature enhances cycle durability.

Amphenol’s cost-effective RADLOK product line can be used as a battery interconnect both internally (cell-to-cell) and externally (battery-to-battery or array-to-power storage units); in electric vehicles, hybrid electric vehicles and fuel cell electric vehicles as well as in servers connecting power to the board.

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Use of a PC-Based Digitizer in Medical Acoustic Microscopy System

Advancing medical acoustic microscopy through innovative digital techniques: maximizing echo detection, enabling high-speed scanning, and achieving precise, synchronized ultrasonic imaging.

For more information, visit www.amphenol-industrial.com

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