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New Low Profile, Quick Release Interconnect From Amphenol Offers High Performance

Amphenol Industrial Global Operations has introduced a low profile, quick release, high power interconnect using Amphenol’s new R4 RADSOK technology.  The new RADLOK product line provides low insertion and extraction forces with a high mating cycle rating for high power interconnects, making it perfect for frequent mating applications.

This high performance connection system features a versatile, low profile, right angle design making it ideal for use in the automotive, heavy equipment, power/battery storage, hybrid-electric system, power interconnect and factory automation markets.  An integrated positive mechanical lock/release feature enhances cycle durability.

Amphenol’s cost-effective RADLOK product line can be used as a battery interconnect both internally (cell-to-cell) and externally (battery-to-battery or array-to-power storage units); in electric vehicles, hybrid electric vehicles and fuel cell electric vehicles as well as in servers connecting power to the board.

- Partner Content -

Shielding Effectiveness Test Guide

Just as interference testing requires RF enclosures, isolation systems in turn need their own testing. This document reviews some of the issues and considerations in testing RF enclosures.

For more information, visit www.amphenol-industrial.com

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