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New Gap Filler Pad Introduced from Fujipoly

Fujipoly has announced the introduction of Sarcon® GR25A-00-50GY, an extremely soft thermal gap filler pad that also exhibits a very low thermal resistance. This thermally conductive silicone-based material easily conforms to most component shapes and board protrusions while exhibiting very low pressure.

When placed between a heat source such as a semiconductor and a nearby heat sink, this 0.5mm thick TIM provides a thermal conductivity of 2.50 W/m°K and a thermal resistance as low as .18 °Cin2/W.  Sarcon® GR25A-00-50GY is available in convenient pre-cut sheets up to a maximum size of 200mm x 300mm (max.) and can also be die cut to your exact application specifications.

 

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The journey to becoming an excellent compliance engineering professional is an ongoing process of continuous learning, practical skill development, and unwavering commitment to ensuring product safety, regulatory compliance, and maintaining the highest standards of professional integrity.

For more information, call (732) 969-0100 or visit http://www.fujipoly.com.

 

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