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New Fuijpoly Gap Filler Pad Exhibits Thermal Resistance of Only .21°Cin2/W

Fujipoly has introduced their new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. This special treatment dramatically reduces material tearing and damage during assembly and rework operations. The new formulation improves cooling performance by filling unwanted air gaps between board components and processors thereby increasing surface contact with a heatsink.

Sarcon® GR25A-0H2-30GY transfers heat with a thermal conductivity of 2.8 W/m°K per ASTM D2326 and a thermal resistance of .21°Cin2/W at 14.5 PSI (1.33°Ccm2/W at 100Kpa).  This flame retardant TIM is available in sheets up to 300mm x 200mm and can be die-cut or trimmed to fit your exact application specifications.

For more information, call (732) 969-0100 or visit us on the Web at www.fujipoly.com.

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Near and Far Field Measurements with a Vector Network Analyzer

For optimal performance in over-the-air RF systems, antennas must meet specific requirements. Performance parameters like size, wind-loading, environmental ruggedness, transmission pattern, bandwidth, and power handling capability should be considered. Methods of measuring the transmission (or reception) pattern that determines antenna gain with a VNA will be examined in this article.

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