New Fine Pitch Wire to Board Solutions from GradConn, Ideal for Restricted Space Applications

GradConn has announced the release of a new fine pitch wire to board range of solutions.  Suitable for any application where space is at a premium such as Laptop PCs, tablets, video cameras and portable GPS systems the new .031” and .039” pitch wire to board range offer tiny PCB footprints and low profile mounted heights.

PCB headers are shrouded and polarized to avoid mis-mating and are available in vertical or horizontal orientation. Cable assemblies are available to suit individual customer design including connector types from other manufacturers.

A combination of vertical PCB header and cable assembly are perfect for areas where PCB space is at a premium, offering a tiny footprint with a mating height of just .155” (in .031” pitch).  Where height above the PCB is critical, right angle headers offer a tiny .069” mated height, with a footprint depth of only .154” (in .031” pitch).

Rated currents are 1.0A for .031” pitch and 0.5A for .039” pitch, with a temperature range of -13°F to 185°F. Cable Sockets and PCB headers are available in a selection of colours for polarisation purposes. Both .031” & .039” versions are ideally suited to many applications where board space is limited or because miniaturisation requires fine pitch connections between PCB’s.

 To see the full range of products, visit