Fujipoly® announces the introduction of Sarcon® GR80A, an extremely soft, high-performance thermal interface material that also exhibits a low thermal resistance. The new material is available in sheets from 0.3mm to 3.0mm thick and can be die-cut to fit almost any application shape.
When placed between a heat source such as a semiconductor and a nearby heat sink, this TIM provides a thermal conductivity of 13.0 W/m°K per ASTM D5470 (8.0 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 0.50°C cm2/W.
The silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas while exhibiting very low pressure. This significantly increases surface contact with a heatsink and improves cooling performance. Sarcon® GR80A can be ordered in convenient pre-cut sheets up to a maximum size of 300mm x 200mm.
