Get our free email newsletter

Leader Tech’s EMI Shielding Material for Precision Die-Cuts

Many electronic enclosures have gaps that allow unwanted RF and electromagnetic interference to escape into the surrounding environment. These openings are commonly found around the I/O panel, backplane and access panels of the enclosure.

A highly effective way to control this problem is to cover these openings with a custom, die-cut shielding gasket. Leader Tech’s low compression CFS Conductive Foam Shielding materials deliver a typical Shielding Effectiveness of 60dB between 10MHz-3GHz and can be die-cut to precise specifications.

CFS Conductive Foam is offered in three standard thicknesses and has a low-resistance polyester fabric surface and a resilient Nickel-Copper polyurethane foam center.  The conductive foam exhibits a compression load of 2.1 psi at 30% compression and has an operational temperature range from -40°F to +156°F. A conductive, pressure sensitive adhesive is also available to help facilitate easy installation.

- Partner Content -

A Dash of Maxwell’s: A Maxwell’s Equations Primer – Part Two

Maxwell’s Equations are eloquently simple yet excruciatingly complex. Their first statement by James Clerk Maxwell in 1864 heralded the beginning of the age of radio and, one could argue, the age of modern electronics.

For more information, visit www.leadertechinc.com.

Related Articles

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, and check out trending engineering news.

Get our email updates

What's New

- From Our Sponsors -

Sign up for the In Compliance Email Newsletter

Discover new products, review technical whitepapers, read the latest compliance news, and trending engineering news.