ITG Electronics has introduced the PM1201C081 Series, an ultra‑low‑profile 5mm dual‑channel power block delivering 80A per phase for high‑density data center, telecom, and networking designs. The new 5mm‑tall, 10×9mm module increases power density by 37.5% compared to ITG’s earlier 8mm version, giving engineers more flexibility in space‑constrained layouts.
Supporting 5–16V input and stepping down to core power rails, the device provides 40A per phase, 80A continuous, and up to 140A peak current. Its thermally enhanced package requires only minimal heatsinking while maintaining excellent thermal performance. Integrated protection features—over‑current, under‑voltage, and over‑temperature—ensure safe operation in mission‑critical environments.
By reducing height while maintaining high current capability, the PM1201C081 Series helps designers minimize board space, shorten trace lengths, and improve airflow and system‑level thermal behavior. As the release notes, “Reducing the height from 8mm to 5mm without compromising performance is a major step forward for high‑density computing environments.”
