September 2025

Overconfidence in basic ESD testing can create dangerous blind spots. Three case studies reveal how standard floor resistance tests miss critical system failures when mobile equipment loses electrical contact, exposing sensitive electronics to static damage despite apparent compliance.

Award-winning research reveals that advanced chip assembly faces unique ESD risks as dies stack closer together. 3D electromagnetic modeling shows discharge currents can exceed 2 amperes in picoseconds, potentially damaging sensitive die-to-die connections despite controlled cleanroom environments.

New harmonized EU cybersecurity standards EN 18031-X took effect August 2025, requiring radio equipment manufacturers to conduct risk assessments across three overlapping standards. Despite similar requirement codes, critical differences in text and restrictions can impact compliance strategies.

Part 4A of a comprehensive shielding series derives two practical approximate solutions from exact electromagnetic theory. For good, thick conductors in far-field conditions, multiple-reflection losses become negligible, significantly simplifying shielding effectiveness calculations for engineers.