This article discusses the common-mode and differential-mode radiation from cables and presents the measurement results from the SMPS connecting wires.
In Part 1 of this two-part article, we’ll discuss the development of “grounding networks” and the shift to meshed structures to reduce damage from overvoltages. Part 2 will appear in our November 2020 issue.
The last thirty years have seen great strides in the deployment of communication network infrastructure. With an increasing emphasis on power-efficient communication for a growing variety of applications, there is a rising awareness that an alternative to IP might need investigation.
Firmware is integral to the operation of most devices, and may represent an easier and less expensive pathway for addressing EMC issues. This article presents different approaches to modifying firmware as well as case studies illustrating the potential effectiveness of this approach.
This article discusses additional requirements that designers and safety professionals may want to consider beyond the base standard for their product based on the environment and user exposure.
This article reviews some of the ESD protection design challenges when designing in a FinFET technology and give an outlook on the successors of FinFET.
This new international specification focuses on workplace safety sign systems. Yet many of its underlying concepts speak to various forms of safety communication meant to reduce risk in today’s world – including product safety labeling.
